[BOND] Changes for rev3

[sistemicorp]

HW Changes that need SW support,

• Battery Emulator DAC moves from HDR 1 to IOX
• Have Battery Emulator calibration move to the setup() call on boot up now that IOX is used.
• Free up HDR1 port6 to the user now that its not used for Battery Emulator
• reduce tolerance for 6V check, its set to 150mV because rev1 had 5.9V. Use 100mV.
• SMPS ENable moved from D13 to D10 because D13 is shared with onboard LED.
• USB-PD was added, so now CYPD3176 can be quiried over I2C from Teensy. (see P1150 code)
• VDUT_EN moved from D41 to D11 to get another analog input pin to measure VNEG2V5
• Add VNEG2V5 measurement
• VDUTSMPS_INT changes from D40 to D12 in order to free up another Teensy analog input, which is not used at the moment.
• BOM change R82 -> 68K
• BOM change R72/74/86 -> 200K
• BOM change INA220 -> INA226
• Add DIODE on VSYS SMPS input
• STLINK-V3MODS add UART connection
• Over current protection done in hardware for various supplied (VDUT, ...)
• NRF JTAG Header (10 pin) in parallel with the big JTAG ribbon cable?? Or keep using the Segger cable converter
• 5th header that uses all MAX11311 ports, so another +12 test points
• Need to change the type of header because there is too much friction, too hard to separate Pogo and BOND.
• ...