atmp

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PreethamSK163 / Project-6-Packaging-Design-and-Simulation-using-ANSYS

A hands-on exploration of semiconductor packaging — covering package types, ATMP processes, thermal simulation of flip-chip BGA packages, reliability testing, and 3D package cross-section modeling using ANSYS Electronics Desktop (AEDT).

thermal-simulations ansys-mechanical wire-bonding semiconductor-packaging ansys-aedt flip-chip-bga atmp package-modeling

Updated Apr 2, 2026

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