Calibration and deembedding for impedance measurments
TUE / BEP - Development and Characterization of a Gold-Bump Flip-Chip Bonding Process for RF IC Applications
Calibration and deembedding for impedance measurments on PCB cells
Measuring magneto-impedance in ferromagnetic wires subjected to external stimuli such as magnetic field, tensile stress, and temperature
Measuring magneto-impedance in ferromagnetic wires subjected to external stimuli such as magnetic field, tensile stress, and temperature
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