Easy-to-use characterization framework for 2.5D chiplet links
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Updated
Aug 10, 2026 - Python
Easy-to-use characterization framework for 2.5D chiplet links
Hard Constraint Projection enhanced neural operator with hybrid sampling for chiplet thermal analysis (Microelectronics Reliability 2026)
Physics-informed thermal surrogate benchmark for 3D/2.5D IC packaging — PINN, FNO/WHNO, PI-DeepONet, and autoregressive operators trained on real 3D-ICE ground truth across 8 geometries (single-die, TSV stacks, chiplets, CoWoS+HBM).
DeepOHeat with legacy and package-level thermal surrogate adapters for Thermal-ChipletPart.
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